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MOTOROLA
SEMICONDUCTOR
TECHNICAL DATA
SOT 23 Dual Monolithic Common Anode Zener
Transient Voltage Suppressor For ESD Protection
This dual monolithic silicon zener diode is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Its dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: * SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration * Peak Power -- 24 Watts @ 1.0 ms (Unidirectional), per Figure 5 Waveform * Maximum Clamping Voltage @ Peak Pulse Current * Low Leakage < 5.0 A * ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Mechanical Characteristics: * Void Free, Transfer-Molded, Thermosetting Plastic Case * Corrosion Resistant Finish, Easily Solderable * Package Designed for Optimal Automated Board Assembly * Small Package Size for High Density Applications * Available in 8 mm Tape and Reel Use the Device Number to Order the 7 inch/3,000 Unit Reel Replace "T1" with "T3" in the Device Number to Order the 13 inch/10,000 Unit Reel WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia THERMAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Peak Power Dissipation @ 1.0 ms (1) @ TA 25C Total Power Dissipation on FR-5 Board (2) @ TA = 25C Derate above 25C Thermal Resistance Junction to Ambient Total Power Dissipation on Alumina Substrate (3) @ TA = 25C Derate above 25C Thermal Resistance Junction to Ambient Junction and Storage Temperature Range Lead Solder Temperature -- Maximum (10 Second Duration)
(1) Non-repetitive current pulse per Figure 5 and derate above TA = 25C per Figure 6. (2) FR-5 = 1.0 x 0.75 x 0.62 in. (3) Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Thermal Clad is a trademark of the Bergquist Company.
MMBZ5V6ALT1
ADDITIONAL VOLTAGES AVAILABLE Motorola Preferred Device
SOT-23 DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 5.6 VOLTS 24 WATTS PEAK POWER
3 1 2
CASE 318-07 STYLE 12 LOW PROFILE SOT-23 PLASTIC
1 3 2 PIN 1. CATHODE 2. CATHODE 3. ANODE
Symbol Ppk PD RJA PD RJA TJ Tstg TL
Value 24 225 1.8 556 300 2.4 417 - 55 to +150 260
Unit Watts mW mW/C C/W mW mW/C C/W C C
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola TVS/Zener Device Data
24 Watt Peak Power Data Sheet 5-55
MMBZ5V6ALT1
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage VZT(4) (V) Min 5.32 Nom 5.6(7) Max 5.88 20 5.0 3.0 11 1600 0.25 Max Reverse Leakage Current IR @ VR (uA) (V) Max Zener Impedance (6) Max Reverse Surge S Current IRSM(5) (A) 3.0 Max Reverse Voltage @ IRSM(5) (Clamping Voltage) VRSM (V) 8.0 Maximum Temperature Coefficient of VZ (mV/C) 1.26
@ I ZT (mA)
ZZT @ IZT () (mA)
ZZK @ IZK () (mA)
(4) VZ measured at pulse test current IT at an ambient temperature of 25C. (5) Surge current waveform per Figure 5 and derate per Figure 6. (6) ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. (7) Other voltages may be available upon request. Please contact your Motorola representative.
.
TYPICAL CHARACTERISTICS
8 IR, REVERSE LEAKAGE CURRENT (nA) 150 VZ, BREAKDOWN VOLTAGE (VOLTS) VZ @ IT 7 BIDIRECTIONAL
10000
6
1000
5
UNIDIRECTIONAL
4 - 50
0
50
100
100 - 50
0
50
100
150
TA, AMBIENT TEMPERATURE (C)
TA, AMBIENT TEMPERATURE (C)
Figure 1. Typical Breakdown Voltage versus Temperature
Figure 2. Typical Leakage Current versus Temperature
300 280 PD , POWER DISSIPATION (mW) 260 C, CAPACITANCE (pF) 240 220 200 180 160 140 120 100 0 1 BIAS (V) 2 3 BIDIRECTIONAL UNIDIRECTIONAL
300 250 ALUMINA SUBSTRATE 200 150 100 FR-5 BOARD 50 0
0
25
50
75
100
125
150
175
TA, AMBIENT TEMPERATURE (C)
Figure 3. Typical Capacitance versus Bias Voltage
Figure 4. Steady State Power Derating Curve
24 Watt Peak Power Data Sheet 5-56
Motorola TVS/Zener Device Data
MMBZ5V6ALT1
TYPICAL CHARACTERISTICS
tr 100 VALUE (%) PEAK VALUE -- IRSM
PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 s
PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 C
100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200
IRSM HALF VALUE -- 2 50 tP 0
0
1
2
3 t, TIME (ms)
4
TA, AMBIENT TEMPERATURE (C)
Figure 5. Pulse Waveform
Figure 6. Pulse Derating Curve
100 Ppk(NOM), NNOMINAL PEAK POWER (W) RECTANGULAR WAVEFORM, TA = 25C Ppk PEAK SURGE POWER (W) BIDIRECTIONAL
100 RECTANGULAR WAVEFORM, TA = 25C BIDIRECTIONAL
10 UNIDIRECTIONAL
10 UNIDIRECTIONAL
1.0 0.1
1.0
10 PW, PULSEWIDTH (ms)
100
1000
1.0
0.1
1.0
10 PW, PULSEWIDTH (ms)
100
1000
Figure 7. Maximum Non-repetitive Surge Power, Ppk versus PW
Power is defined as VRSM x IZ(pk) where VRSM is the clamping voltage at IZ(pk).
Figure 8. Maximum Non-repetitive Surge Power, Ppk(NOM) versus PW
Power is defined as VZ(NOM) x IZ(pk) where VZ(NOM) is the nominal zener voltage measured at the low test current used for voltage classification.
Motorola TVS/Zener Device Data
24 Watt Peak Power Data Sheet 5-57
MMBZ5V6ALT1
TYPICAL COMMON ANODE APPLICATIONS
A dual junction common anode design in a SOT-23 package protects two separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of MMBZ5V6ALT1 TVS applications are illustrated below.
Computer Interface Protection
A KEYBOARD TERMINAL PRINTER ETC. B I/O C D FUNCTIONAL DECODER
GND MMBZ5V6ALT1
Microprocessor Protection
VDD VGG ADDRESS BUS
RAM
ROM
DATA BUS I/O CPU CLOCK CONTROL BUS MMBZ5V6ALT1
GND MMBZ5V6ALT1
24 Watt Peak Power Data Sheet 5-58
Motorola TVS/Zener Device Data
MMBZ5V6ALT1
INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95
0.037 0.95
0.079 2.0 0.035 0.9 0.031 0.8
inches mm
SOT-23
SOT-23 POWER DISSIPATION
The power dissipation of the SOT-23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT-23 package, PD can be calculated as follows: PD = TJ(max) - TA RJA
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 24 Watt Peak Power Data Sheet 5-59
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 150C - 25C = 225 milliwatts 556C/W
The 556C/W for the SOT-23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
Motorola TVS/Zener Device Data
Transient Voltage Suppressors -- Surface Mounted
24 Watt Peak Power
A L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
3
B
1 2
S
V
G
C D H K J
DIM A B C D G H J K L S V
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60
STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE
CASE 318-07 PLASTIC
(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)
MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS
Package Option Tape and Reel Tape and Reel Type No. Suffix T1 T3 MPQ (Units) 3K 10K
(Refer to Section 10 for more information on Packaging Specifications.)
24 Watt Peak Power Data Sheet 5-60
Motorola TVS/Zener Device Data
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MMBZ15VDLT1/D
15 & 27 Volt SOT-23 Dual Monolithic Common Cathode Zeners
Transient Voltage Suppressors for ESD Protection
These dual monolithic silicon zener diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common cathode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features: * SOT-23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration * Peak Power -- 40 Watts @ 1.0 ms (Bidirectional), per Figure 5 Waveform * Maximum Clamping Voltage @ Peak Pulse Current * Low Leakage < 100 nA * ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Mechanical Characteristics: * Void Free, Transfer-Molded, Thermosetting Plastic Case * Corrosion Resistant Finish, Easily Solderable * Package Designed for Optimal Automated Board Assembly * Small Package Size for High Density Applications * Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace the "T1" with "T3" in the Device Number to order the 13 inch/10,000 unit reel.
MMBZ15VDLT1 MMBZ27VCLT1
Motorola Preferred Devices
SOT-23 COMMON CATHODE DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 40 WATTS PEAK POWER
3
1 2
CASE 318-08 TO-236AB LOW PROFILE SOT-23
1 3 2 TERMINAL 1 - ANODE TERMINAL 2 - ANODE TERMINAL 3 - CATHODE
THERMAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Peak Power Dissipation @ 1.0 ms (1) @ TA 25C Total Power Dissipation on FR-5 Board (2) @ TA = 25C Derate above 25C Thermal Resistance Junction to Ambient Total Power Dissipation on Alumina Substrate (3) @ TA = 25C Derate above 25C Thermal Resistance Junction to Ambient Junction and Storage Temperature Range Lead Solder Temperature -- Maximum (10 Second Duration) 1. Non-repetitive current pulse per Figure 5 and derate above TA = 25C per Figure 6. 2. FR-5 = 1.0 x 0.75 x 0.62 in. 3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 (c) Motorola, Inc. 1996
Symbol Ppk PD RJA PD RJA TJ Tstg TL
Value 40 225 1.8 556 300 2.4 417 - 55 to +150 230
Unit Watts mW mW/C C/W mW mW/C C/W C C
MMBZ15VDLT1 MMBZ27VCLT1
MOTOROLA 61
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage VBR(4) (V) Min 14.3 Nom 15 Max 15.8 1.0 @ IT (mA) Reverse Voltage Working Peak VRWM (V) 12.8 Max Reverse Leakage Current IRWM IR (nA) 100 Max Reverse Surge Current IRSM(5) (A) 1.9 Max Reverse Voltage @ IRSM(5) (Clamping Voltage) VRSM (V) 21.2 Maximum Temperature Temperat re Coefficient of VBR (mV/C) 12
(VF = 1.1 V Max @ IF = 200 mA)
Breakdown Voltage VBR(4) (V) Min 25.65 Nom 27 Max 28.35 1.0 @ IT (mA) Reverse Voltage Working Peak VRWM (V) 22 Max Reverse Leakage Current IRWM IR (nA) 50 Max Reverse Surge Current IRSM(5) (A) 1.0 Max Reverse Voltage @ IRSM(5) V lt (Clamping Voltage) VRSM (V) 38 Maximum Temperature T t Coefficient of VBR (mV/C) 26
(4) VBR measured at pulse test current IT at an ambient temperature of 25C. (5) Surge current waveform per Figure 5 and derate per Figure 6.
TYPICAL CHARACTERISTICS
MMBZ15VDLT1
17 BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T ) BIDIRECTIONAL 16 BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T ) 29 BIDIRECTIONAL 28
MMBZ27VCLT1
15
27
14 UNIDIRECTIONAL 13 - 40
26
+ 25 + 85 TEMPERATURE (C)
+ 125
25 - 55
+ 25 + 85 TEMPERATURE (C)
+ 125
Figure 1A. Typical Breakdown Voltage versus Temperature
Figure 1B. Typical Breakdown Voltage versus Temperature
MOTOROLA 62
MMBZ15VDLT1 MMBZ27VCLT1
MMBZ15VDLT1
10000 100 90 100 C, CAPACITANCE (pF) 80 70 60 50 40 30 20 10 0.01 - 40 + 25 + 85 TEMPERATURE (C) + 125 0 1 BIAS (V) 12.8 BIDIRECTIONAL UNIDIRECTIONAL
IR (nA)
10
1
0.1
Figure 2. Typical Leakage Current versus Temperature
Figure 3. Typical Capacitance versus Bias Voltage
300 250 ALUMINA SUBSTRATE 200 VALUE (%) 150 100 FR-5 BOARD 50 0 0 tP 100 tr PEAK VALUE -- IRSM
PD , POWER DISSIPATION (mW)
PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 s IRSM 2
HALF VALUE -- 50
0
25
50
75 100 125 TEMPERATURE (C)
150
175
0
1
2
3 t, TIME (ms)
4
Figure 4. Steady State Power Derating Curve
Figure 5. Pulse Waveform
PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25 C
100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) 175 200
Figure 6. Pulse Derating Curve
MMBZ15VDLT1 MMBZ27VCLT1
MOTOROLA 63
INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
0.037 0.95
0.037 0.95
0.079 2.0 0.035 0.9 0.031 0.8
inches mm
SOT-23 SOT-23 POWER DISSIPATION
The power dissipation of the SOT-23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT-23 package, PD can be calculated as follows: PD = TJ(max) - TA RJA
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 150C - 25C 556C/W = 225 milliwatts
The 556C/W for the SOT-23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
MOTOROLA 64
MMBZ15VDLT1 MMBZ27VCLT1
OUTLINE DIMENSIONS
A L
3
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
BS
1 2
V
G C D H K J
DIM A B C D G H J K L S V
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
CASE 318-08 ISSUE AE TO-236AB
STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE
MMBZ15VDLT1 MMBZ27VCLT1
MOTOROLA 65
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 66
*MMBZ15VDLT1/D*
MMBZ15VDLT1 MMBZ27VCLT1
MMBZ15VDLT1/D
Transient Voltage Suppressors -- Surface Mounted
40 Watt Peak Power
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A B C D G H J K L S V INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0180 0.0236 0.0350 0.0401 0.0830 0.0984 0.0177 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.45 0.60 0.89 1.02 2.10 2.50 0.45 0.60
0.037 0.95
0.037 0.95
A L
3
STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE
0.079 2.0 0.035 0.9 0.031 0.8
inches mm
B
1 2
S
V
G
C D H K J CASE 318-07 PLASTIC
(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)
SOT-23 Footprint
MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS
Package Option Tape and Reel Tape and Reel Type No. Suffix T1 T3 MPQ (Units) 3K 10K
(Refer to Section 10 for more information on Packaging Specifications.)
Motorola TVS/Zener Device Data
24 Watt Peak Power Data Sheet 5-67
MOTOROLA
SEMICONDUCTOR
TECHNICAL DATA GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP
GENERAL DATA
600 WATT PEAK POWER
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 6.8-200 VOLTS 600 WATT PEAK POWER
Zener Transient Voltage Suppressors
The SMB series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMB series is supplied in Motorola's exclusive, cost-effective, highly reliable Surmetic package and is ideally suited for use in communication systems, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications.
* * * * * * *
Specification Features: Standard Zener Breakdown Voltage Range -- 6.8 to 200 V Stand-off Voltage Range -- 5 to 170 V Peak Power -- 600 Watts @ 1 ms Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5 A Above 10 V UL Recognition Response Time Typically < 1 ns
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode MOUNTING POSITION: Any LEADS: Modified L-Bend providing more contact area to bond pad MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 seconds WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia MAXIMUM RATINGS
Rating Peak Power Dissipation (1) @ TL 25C Forward Surge Current (2) @ TA = 25C Thermal Resistance from Junction to Lead (typical) Operating and Storage Temperature Range
NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above TA = 25C per Figure 3. NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
CASE 403A PLASTIC
Symbol PPK IFSM RqJL TJ, Tstg
Value 600 100 25 - 65 to +150
Unit Watts Amps C/W C
REV 1
600 Watt Peak Power Data Sheet 5-68
Motorola TVS/Zener Device Data
GENERAL DATA -- 600 WATT PEAK POWER
100 NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 2 10 100 VALUE (%) PEAK VALUE - IRSM tr PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 s
PP, PEAK POWER (kW)
1
50 tP
I HALF VALUE - RSM 2
0.1 0.1 s
1 s
10 s
100 s
1 ms
10 ms
0
0
1
2 t, TIME (ms)
3
4
tP, PULSE WIDTH
Figure 1. Pulse Rating Curve
160 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ T = 25 C A 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150 Vin Zin
Figure 2. Pulse Waveform
TYPICAL PROTECTION CIRCUIT
LOAD
VL
TA, AMBIENT TEMPERATURE (C)
Figure 3. Pulse Derating Curve
APPLICATION NOTES
RESPONSE TIME In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 4. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 5. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMB series have a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing Motorola TVS/Zener Device Data the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. DUTY CYCLE DERATING The data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 6. Average power must be derated as the lead or ambient temperature rises above 25C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 6 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 s pulse. However, when the derating factor for a given pulse of Figure 6 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend. 600 Watt Peak Power Data Sheet 5-69
GENERAL DATA -- 600 WATT PEAK POWER
Vin (TRANSIENT) VL VL
V
Vin (TRANSIENT)
V
OVERSHOOT DUE TO INDUCTIVE EFFECTS
Vin td
tD = TIME DELAY DUE TO CAPACITIVE EFFECT t
t
Figure 4.
Figure 5.
1 0.7 0.5 0.3 DERATING FACTOR 0.2 0.1 0.07 0.05 0.03 0.02 10 s 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 100 PULSE WIDTH 10 ms
1 ms 100 s
Figure 6. Typical Derating Factor for Duty Cycle
UL RECOGNITION
The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category.
600 Watt Peak Power Data Sheet 5-70
Motorola TVS/Zener Device Data
1SMB5.0AT3 through 1SMB170AT3
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted).
Breakdown Voltage* Reverse Stand-Off Voltage VR Volts (1) VBR @ IT Volts Min mA Maximum Clamping Voltage VC @ Ipp Volts Peak Pulse Current (See Figure 2) Ipp{ Amps Maximum Reverse Re erse Leakage @ VR IR A
Device{{
Device Marking
1SMB5.0AT3 1SMB6.0AT3 1SMB6.5AT3 1SMB7.0AT3
1SMB7.5AT3 1SMB8.0AT3 1SMB8.5AT3 1SMB9.0AT3 1SMB10AT3 1SMB11AT3 1SMB12AT3 1SMB13AT3 1SMB14AT3 1SMB15AT3 1SMB16AT3 1SMB17AT3 1SMB18AT3 1SMB20AT3 1SMB22AT3 1SMB24AT3 1SMB26AT3 1SMB28AT3 1SMB30AT3 1SMB33AT3 1SMB36AT3 1SMB40AT3 1SMB43AT3 1SMB45AT3 1SMB48AT3 1SMB51AT3 1SMB54AT3 1SMB58AT3 1SMB60AT3 1SMB64AT3 1SMB70AT3 1SMB75AT3 1SMB78AT3 1SMB85AT3 1SMB90AT3 1SMB100AT3 1SMB110AT3 1SMB120AT3 1SMB130AT3 1SMB150AT3 1SMB160AT3 1SMB170AT3
5.0 6.0 6.5 7.0
7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 85 90 100 110 120 130 150 160 170
6.40 6.67 7.22 7.78
8.33 8.89 9.44 10.0 11.1 12.2 13.3 14.4 15.6 16.7 17.8 18.9 20.0 22.2 24.4 26.7 28.9 31.1 33.3 36.7 40.0 44.4 47.8 50.0 53.3 56.7 60.0 64.4 66.7 71.1 77.8 83.3 86.7 94.4 100 111 122 133 144 167 178 189
10 10 10 10
1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0
9.2 10.3 11.2 12.0
12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103 113 121 126 137 146 162 177 193 209 243 259 275
65.2 58.3 53.6 50.0
46.5 44.1 41.7 39.0 35.3 33.0 30.2 27.9 25.8 24.0 23.1 21.7 20.5 18.5 16.9 15.4 14.2 13.2 12.4 11.3 10.3 9.3 8.6 8.3 7.7 7.3 6.9 6.4 6.2 5.8 5.3 4.9 4.7 4.4 4.1 3.7 3.4 3.1 2.9 2.5 2.3 2.2
800 800 500 200
100 50 10 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
KE KG KK KM
KP KR KT KV KX KZ LE LG LK LM LP LR LT LV LX LZ ME MG MK MM MP MR MT MV MX MZ NE NG NK NM NP NR NT NV NX NZ PE PG PK PM PP PR
{{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data -- 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units.
Note 1: A transient suppressor is normally selected according to the reverse "Stand Off Voltage" (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25C.
ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a non-conductive condition (See Note 1). V(BR)min This is the minimum breakdown voltage the device will exhibit and is used to assure that conduction does not occur prior to this voltage level at 25C. VC Maximum Clamping Voltage. The maximum peak voltage appearing across the transient suppressor when Devices listed in bold, italic are Motorola preferred devices.
IPP PP IR
subjected to the peak pusle current in a one millisecond time interval. The peak pulse voltages are the combination of voltage rise due to both the series resistance and thermal rise. Peak Pulse Current -- See Figure 2 Peak Pulse Power Reverse Leakage
Motorola TVS/Zener Device Data
600 Watt Peak Power Data Sheet 5-71
P6SMB6.8AT3 through P6SMB200AT3
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted).
Breakdown Voltage* Reverse Stand-Off Voltage VR Volts (1) 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 VBR @ IT Volts Min 11.1 12.2 13.3 14.4 15.6 16.7 17.8 18.9 20.0 22.2 24.4 26.7 28.9 31.1 33.3 36.7 40.0 44.4 47.8 50.0 53.3 56.7 60.0 64.4 66.7 71.1 77.8 83.3 86.7 mA 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Maximum Clamping Voltage VC @ Ipp Volts 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103 113 121 126 Peak Pulse Current (See Figure 2) Ipp{ Amps 35.3 33.0 30.2 27.9 25.8 24.0 23.1 21.7 20.5 18.5 16.9 15.4 14.2 13.2 12.4 11.3 10.3 9.3 8.6 8.3 7.7 7.3 6.9 6.4 6.2 5.8 5.3 4.9 4.7 Maximum Reverse Re erse Leakage @ VR IR A 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
Device{{ 1SMB10CAT3 1SMB11CAT3 1SMB12CAT3 1SMB13CAT3 1SMB14CAT3 1SMB15CAT3 1SMB16CAT3 1SMB17CAT3 1SMB18CAT3 1SMB20CAT3 1SMB22CAT3 1SMB24CAT3 1SMB26CAT3 1SMB28CAT3 1SMB30CAT3 1SMB33CAT3 1SMB36CAT3 1SMB40CAT3 1SMB43CAT3 1SMB45CAT3 1SMB48CAT3 1SMB51CAT3 1SMB54CAT3 1SMB58CAT3 1SMB60CAT3 1SMB64CAT3 1SMB70CAT3 1SMB75CAT3 1SMB78CAT3
Device Marking KXC KZC LEC LGC LKC LMC LPC LRC LTC LVC LXC LZC MEC MGC MKC MMC MPC MRC MTC MVC MXC MZC NEC NGC NKC NMC NPC NRC NTC
{{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data -- 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units.
Note 1: A transient suppressor is normally selected according to the reverse "Stand Off Voltage" (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25C.
ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a non-conductive condition (See Note 1). V(BR)min This is the minimum breakdown voltage the device will exhibit and is used to assure that conduction does not occur prior to this voltage level at 25C. VC Maximum Clamping Voltage. The maximum peak voltage appearing across the transient suppressor when
IPP PP IR
subjected to the peak pusle current in a one millisecond time interval. The peak pulse voltages are the combination of voltage rise due to both the series resistance and thermal rise. Peak Pulse Current -- See Figure 2 Peak Pulse Power Reverse Leakage
Devices listed in bold, italic are Motorola preferred devices.
600 Watt Peak Power Data Sheet 5-72
Motorola TVS/Zener Device Data
1SMB10CAT3 through 1SMB78CAT3 Bi-Directional
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) VF = 3.5 V Max, IF** = 50 A for all types.
Breakdown Voltage* VBR @ IT Volts Device{{ D i {{ Min Nom Max mA Working Peak Reverse R Voltage VRWM Volts Maximum Reverse Leakage Lk @ VRWM IR A Maximum Reverse Surge S Current IRSM{ Amps Maximum Reverse Voltage g @ IRSM (Clamping Voltage) VRSM Volts Maximum Temperature Coefficient of VBR %/C
Device Di Marking
P6SMB6.8AT3 P6SMB7.5AT3 P6SMB8.2AT3 P6SMB9.1AT3 P6SMB10AT3 P6SMB11AT3 P6SMB12AT3 P6SMB13AT3 P6SMB15AT3 P6SMB16AT3 P6SMB18AT3 P6SMB20AT3 P6SMB22AT3 P6SMB24AT3 P6SMB27AT3 P6SMB30AT3
P6SMB33AT3 P6SMB36AT3 P6SMB39AT3 P6SMB43AT3 P6SMB47AT3 P6SMB51AT3 P6SMB56AT3 P6SMB62AT3 P6SMB68AT3 P6SMB75AT3 P6SMB82AT3 P6SMB91AT3 P6SMB100AT3 P6SMB110AT3 P6SMB120AT3 P6SMB130AT3 P6SMB150AT3 P6SMB160AT3 P6SMB170AT3 P6SMB180AT3 P6SMB200AT3
6.45 7.13 7.79 8.65 9.5 10.5 11.4 12.4 14.3 15.2 17.1 19 20.9 22.8 25.7 28.5
31.4 34.2 37.1 40.9 44.7 48.5 53.2 58.9 64.6 71.3 77.9 86.5 95 105 114 124 143 152 162 171 190
6.8 7.5 8.2 9.1 10 11 12 13 15 16 18 20 22 24 27 30
33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 160 170 180 200
7.14 7.88 8.61 9.55 10.5 11.6 12.6 13.7 15.8 16.8 18.9 21 23.1 25.2 28.4 31.5
34.7 37.8 41 45.2 49.4 53.6 58.8 65.1 71.4 78.8 86.1 95.5 105 116 126 137 158 168 179 189 210
10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
5.8 6.4 7.02 7.78 8.55 9.4 10.2 11.1 12.8 13.6 15.3 17.1 18.8 20.5 23.1 25.6
28.2 30.8 33.3 36.8 40.2 43.6 47.8 53 58.1 64.1 70.1 77.8 85.5 94 102 111 128 136 145 154 171
1000 500 200 50 10 5 5 5 5 5 5 5 5 5 5 5
5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5
57 53 50 45 41 38 36 33 28 27 24 22 20 18 16 14.4
13.2 12 11.2 10.1 9.3 8.6 7.8 7.1 6.5 5.8 5.3 4.8 4.4 4 3.6 3.3 2.9 2.7 2.6 2.4 2.2
10.5 11.3 12.1 13.4 14.5 15.6 16.7 18.2 21.2 22.5 25.2 27.7 30.6 33.2 37.5 41.4
45.7 49.9 53.9 59.3 64.8 70.1 77 85 92 103 113 125 137 152 165 179 207 219 234 246 274
0.057 0.061 0.065 0.068 0.073 0.075 0.078 0.081 0.084 0.086 0.088 0.09 0.092 0.094 0.096 0.097
0.098 0.099 0.1 0.101 0.101 0.102 0.103 0.104 0.104 0.105 0.105 0.106 0.106 0.107 0.107 0.107 0.108 0.108 0.108 0.108 0.108
6V8A 7V5A 8V2A 9V1A 10A 11A 12A 13A 15A 16A 18A 20A 22A 24A 27A 30A
33A 36A 39A 43A 47A 51A 56A 62A 68A 75A 82A 91A 100A 110A 120A 130A 150A 160A 170A 180A 200A
* * VBR measured at pulse test current IT at an ambient temperaure of 25C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
{{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data -- 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units.
Devices listed in bold, italic are Motorola preferred devices.
Motorola TVS/Zener Device Data
600 Watt Peak Power Data Sheet 5-73
P6SMB11CAT3 through P6SMB91CAT3 Bi-Directional
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) VF = 3.5 V Max, IF** = 50 A for all types.
Breakdown Voltage* VBR @ IT Volts Device{{ D i {{ P6SMB11CAT3 P6SMB12CAT3 P6SMB13CAT3 P6SMB15CAT3 P6SMB16CAT3 P6SMB18CAT3 P6SMB20CAT3 P6SMB22CAT3 P6SMB24CAT3 P6SMB27CAT3 P6SMB30CAT3 Min 10.5 11.4 12.4 14.3 15.2 17.1 19 20.9 22.8 25.7 28.5 Nom 11 12 13 15 16 18 20 22 24 27 30 Max 11.6 12.6 13.7 15.8 16.8 18.9 21 23.1 25.2 28.4 31.5 mA 1 1 1 1 1 1 1 1 1 1 1 Working Peak Reverse Voltage VRWM Volts 9.4 10.2 11.1 12.8 13.6 15.3 17.1 18.8 20.5 23.1 25.6 Maximum Reverse Leakage @ VRWM IR A 5 5 5 5 5 5 5 5 5 5 5 Maximum Reverse Surge Current IRSM{ Amps 38 36 33 28 27 24 22 20 18 16 14.4 Maximum Reverse Voltage @ IRSM (Clamping Voltage) VRSM Volts 15.6 16.7 18.2 21.2 22.5 25.2 27.7 30.6 33.2 37.5 41.4
Maximum Temperature Coefficient of VBR %/C 0.075 0.078 0.081 0.084 0.086 0.088 0.09 0.092 0.094 0.096 0.097
Device Di Marking 11C 12C 13C 15C 16C 18C 20C 22C 24C 27C 30C
P6SMB33CAT3 P6SMB36CAT3 P6SMB39CAT3 P6SMB43CAT3
P6SMB47CAT3 P6SMB51CAT3 P6SMB56CAT3 P6SMB62CAT3 P6SMB68CAT3 P6SMB75CAT3 P6SMB82CAT3 P6SMB91CAT3
31.4 34.2 37.1 40.9
44.7 48.5 53.2 58.9 64.6 71.3 77.9 86.5
33 36 39 43
47 51 56 62 68 75 82 91
34.7 37.8 41 45.2
49.4 53.6 58.8 65.1 71.4 78.8 86.1 95.5
1 1 1 1
1 1 1 1 1 1 1 1
28.2 30.8 33.3 36.8
40.2 43.6 47.8 53 58.1 64.1 70.1 77.8
5 5 5 5
5 5 5 5 5 5 5 5
13.2 12 11.2 10.1
9.3 8.6 7.8 7.1 6.5 5.8 5.3 4.8
45.7 49.9 53.9 59.3
64.8 70.1 77 85 92 103 113 125
0.098 0.099 0.1 0.101
0.101 0.102 0.103 0.104 0.104 0.105 0.105 0.106
33C 36C 39C 43C
47C 51C 56C 62C 68C 75C 82C 91C
* * VBR measured at pulse test current IT at an ambient temperaure of 25C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
{{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data -- 600 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units.
600 Watt Peak Power Data Sheet 5-74
Motorola TVS/Zener Device Data
Transient Voltage Suppressors -- Surface Mounted
600 Watt Peak Power
0.089 2.261 S A 0.108 2.743
D
B
0.085 2.159
inches mm
SMB Footprint
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. INCHES MIN MAX 0.160 0.180 0.130 0.150 0.075 0.095 0.077 0.083 0.0020 0.0060 0.006 0.012 0.030 0.050 0.020 REF 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59
C
K
P
J
H
DIM A B C D H J K P S
CASE 403A PLASTIC
(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)
MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS
Package Option Tape and Reel Type No. Suffix T3 (13 inch reel) MPQ (Units) 2.5K
(Refer to Section 10 for more information on Packaging Specifications.)
Devices listed in bold, italic are Motorola preferred devices.
Motorola TVS/Zener Device Data
600 Watt Peak Power Data Sheet 5-75
MOTOROLA
SEMICONDUCTOR
TECHNICAL DATA GENERAL DATA APPLICABLE TO ALL SERIES IN THIS GROUP
GENERAL DATA
1500 WATT PEAK POWER
PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 6.8-91 VOLTS 1500 WATT PEAK POWER
Zener Transient Voltage Suppressors
The SMC series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SMC series is supplied in Motorola's exclusive, cost-effective, highly reliable Surmetic package and is ideally suited for use in communication systems, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications.
* * * * * * * * *
Specification Features: Standard Zener Breakdown Voltage Range -- 6.8 to 91 V Stand-off Voltage Range -- 5 to 78 V Peak Power -- 1500 Watts @ 1 ms Maximum Clamp Voltage @ Peak Pulse Current Low Leakage < 5 A Above 10 V UL Recognition Maximum Temperature Coefficient Specified Available in Tape and Reel Response Time Typically < 1 ns
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic FINISH: All external surfaces are corrosion resistant and leads are readily solderable POLARITY: Cathode indicated by molded polarity notch. When operated in zener mode, will be positive with respect to anode MOUNTING POSITION: Any LEADS: Modified L-Bend providing more contact area to bond pads MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 seconds WAFER FAB LOCATION: Phoenix, Arizona ASSEMBLY/TEST LOCATION: Seremban, Malaysia MAXIMUM RATINGS
Rating Peak Power Dissipation (1) @ TL 25C Forward Surge Current (2) @ TA = 25C Thermal Resistance from Junction to Lead (typical) Operating and Storage Temperature Range
NOTES: 1. Nonrepetitive current pulse per Figure 2 and derated above TA = 25C per Figure 3. NOTES: 2. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
CASE 403 PLASTIC
Symbol PPK IFSM RqJL TJ, Tstg
Value 1500 200 15 - 65 to +150
Unit Watts Amps C/W C
REV 1
1500 Watt Peak Power Data Sheet 5-76
Motorola TVS/Zener Device Data
GENERAL DATA -- 1500 WATT PEAK POWER
100 NONREPETITIVE PULSE WAVEFORM SHOWN IN FIGURE 2 100 10 VALUE (%) tr PEAK VALUE - IRSM PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAYS TO 50% OF IRSM. tr 10 s
PP, PEAK POWER (kW)
50 tP 1 0.1 s 1 s 10 s 100 s 0
I HALF VALUE - RSM 2
1 ms
10 ms
0
1
2 t, TIME (ms)
3
4
tP, PULSE WIDTH
Figure 1. Pulse Rating Curve
Figure 2. Pulse Waveform
160 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ T = 25 C A 140 120 100 80 60 40 20 0 0 25 50 75 100 125 150 1000 500 I Z , ZENER CURRENT (AMPS) 200 100 50 20 10 5 2 1 0.3 120 V 180 V TL = 25C tP = 10 s VZ (NOM) = 6.8 TO 13 V 20 V 43 V 24 V 75 V
0.5 0.7 1
2
3
5
7
10
20
30
TA, AMBIENT TEMPERATURE (C)
VZ, INSTANTANEOUS INCREASE IN VZ ABOVE VZ (NOM) (VOLTS)
Figure 3. Pulse Derating Curve
Figure 4. Dynamic Impedance
UL RECOGNITION
The entire series has Underwriters Laboratory Recognition for the classification of protectors (QVGV2) under the UL standard for safety 497B and File #116110. Many competitors only have one or two devices recognized or have recognition in a non-protective category. Some competitors have no recognition at all. With the UL497B recognition, our parts successfully passed several tests including Strike Voltage Breakdown test, Endurance Conditioning, Temperature test, Dielectric Voltage-Withstand test, Discharge test and several more. Whereas, some competitors have only passed a flammability test for the package material, we have been recognized for much more to be included in their Protector category.
Motorola TVS/Zener Device Data
1500 Watt Peak Power Data Sheet 5-77
GENERAL DATA -- 1500 WATT PEAK POWER
APPLICATION NOTES
RESPONSE TIME In most applications, the transient suppressor device is placed in parallel with the equipment or component to be protected. In this situation, there is a time delay associated with the capacitance of the device and an overshoot condition associated with the inductance of the device and the inductance of the connection method. The capacitive effect is of minor importance in the parallel protection scheme because it only produces a time delay in the transition from the operating voltage to the clamp voltage as shown in Figure 5. The inductive effects in the device are due to actual turn-on time (time required for the device to go from zero current to full current) and lead inductance. This inductive effect produces an overshoot in the voltage across the equipment or component being protected as shown in Figure 6. Minimizing this overshoot is very important in the application, since the main purpose for adding a transient suppressor is to clamp voltage spikes. The SMC series have a very good response time, typically < 1 ns and negligible inductance. However, external inductive effects could produce unacceptable overshoot. Proper circuit layout, minimum lead lengths and placing the suppressor device as close as possible to the equipment or components to be protected will minimize this overshoot. Some input impedance represented by Zin is essential to prevent overstress of the protection device. This impedance should be as high as possible, without restricting the circuit operation. DUTY CYCLE DERATING The data of Figure 1 applies for non-repetitive conditions and at a lead temperature of 25C. If the duty cycle increases, the peak power must be reduced as indicated by the curves of Figure 7. Average power must be derated as the lead or ambient temperature rises above 25C. The average power derating curve normally given on data sheets may be normalized and used for this purpose. At first glance the derating curves of Figure 7 appear to be in error as the 10 ms pulse has a higher derating factor than the 10 s pulse. However, when the derating factor for a given pulse of Figure 7 is multiplied by the peak power value of Figure 1 for the same pulse, the results follow the expected trend.
TYPICAL PROTECTION CIRCUIT
Zin
Vin
LOAD
VL
Vin (TRANSIENT) V VL V OVERSHOOT DUE TO INDUCTIVE EFFECTS
Vin (TRANSIENT) VL
Vin td tD = TIME DELAY DUE TO CAPACITIVE EFFECT t
t
Figure 5.
1 0.7 0.5 0.3 DERATING FACTOR 0.2 0.1 0.07 0.05 0.03 0.02 10 s 0.01 0.1 0.2 0.5 1 2 5 10 D, DUTY CYCLE (%) 20 50 PULSE WIDTH 10 ms
Figure 6.
1 ms 100 s
100
Figure 7. Typical Derating Factor for Duty Cycle Motorola TVS/Zener Device Data
1500 Watt Peak Power Data Sheet 5-78
1SMC5.0AT3 through 1SMC78AT3
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted).
Breakdown Voltage* Reverse Stand-Off Voltage VR Volts (1) 5.0 6.0 6.5 7.0 7.5 8.0 8.5 9.0 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 VBR @ IT Volts Min 6.40 6.67 7.22 7.78 8.33 8.89 9.44 10.0 11.1 12.2 13.3 14.4 15.6 16.7 17.8 18.9 20.0 22.2 24.4 26.7 28.9 31.1 33.3 36.7 40.0 44.4 47.8 50.0 53.3 56.7 60.0 64.4 66.7 71.1 77.8 83.3 86.7 mA 10 10 10 10 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Maximum Clamping Voltage VC @ Ipp Volts 9.2 10.3 11.2 12.0 12.9 13.6 14.4 15.4 17.0 18.2 19.9 21.5 23.2 24.4 26.0 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103 113 121 126 Peak Pulse Current (See Figure 2) Ipp{ Amps 163.0 145.6 133.9 125.0 116.3 110.3 104.2 97.4 88.2 82.4 75.3 69.7 64.7 61.5 57.7 53.3 51.4 46.3 42.2 38.6 35.6 33.0 31.0 28.1 25.8 23.2 21.6 20.6 19.4 18.2 17.2 16.0 15.5 14.6 13.3 12.4 11.4 Maximum Reverse Re erse Leakage @ VR IR A 1000 1000 500 200 100 50 20 10 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0
Device{{ 1SMC5.0AT3 1SMC6.0AT3 1SMC6.5AT3 1SMC7.0AT3 1SMC7.5AT3 1SMC8.0AT3 1SMC8.5AT3 1SMC9.0AT3 1SMC10AT3 1SMC11AT3 1SMC12AT3 1SMC13AT3 1SMC14AT3 1SMC15AT3 1SMC16AT3 1SMC17AT3 1SMC18AT3 1SMC20AT3 1SMC22AT3 1SMC24AT3 1SMC26AT3 1SMC28AT3 1SMC30AT3 1SMC33AT3 1SMC36AT3 1SMC40AT3 1SMC43AT3 1SMC45AT3 1SMC48AT3 1SMC51AT3 1SMC54AT3 1SMC58AT3 1SMC60AT3 1SMC64AT3 1SMC70AT3 1SMC75AT3 1SMC78AT3
Device Marking GDE GDG GDK GDM GDP GDR GDT GDV GDX GDZ GEE GEG GEK GEM GEP GER GET GEV GEX GEZ GFE GFG GFK GFM GFP GFR GFT GFV GFX GFZ GGE GGG GGK GGM GGP GGR GGT
{{ Surge current waveform per Figure 2 and derate per Figure 3 of the General Data -- 1500 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units.
Note 1: A transient suppressor is normally selected according to the reverse "Stand Off Voltage" (VR) which should be equal to or greater than the DC or continuous peak operating voltage level. * * VBR measured at pulse test current IT at an ambient temperaure of 25C.
ABBREVIATIONS AND SYMBOLS VR Stand Off Voltage. Applied reverse voltage to assure a non-conductive condition (See Note 1). V(BR)min This is the minimum breakdown voltage the device will exhibit and is used to assure that conduction does not occur prior to this voltage level at 25C. VC Maximum Clamping Voltage. The maximum peak voltage appearing across the transient suppressor when
IPP PP IR
subjected to the peak pusle current in a one millisecond time interval. The peak pulse series resistance and thermal rise. Peak Pulse Current -- See Figure 2 Peak Pulse Power Reverse Leakage
Devices listed in bold, italic are Motorola preferred devices.
Motorola TVS/Zener Device Data
1500 Watt Peak Power Data Sheet 5-79
1SMC6.8AT3 through 1.5SMC91AT3
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) VF = 3.5 V Max, IF** = 100 A for all types.
Breakdown Voltage* VBR @ IT Volts Device{{ D i {{ 1.5SMC6.8AT3 1.5SMC7.5AT3 1.5SMC8.2AT3 1.5SMC9.1AT3 1.5SMC10AT3 1.5SMC11AT3 1.5SMC12AT3 1.5SMC13AT3 Min 6.45 7.13 7.79 8.65 9.5 10.5 11.4 12.4 Nom 6.8 7.5 8.2 9.1 10 11 12 13 Max 7.14 7.88 8.61 9.55 10.5 11.6 12.6 13.7 mA 10 10 10 1 1 1 1 1 Working Peak Reverse R Voltage VRWM Volts 5.8 6.4 7.02 7.78 8.55 9.4 10.2 11.1 Maximum Reverse Leakage Lk @ VRWM IR A 1000 500 200 50 10 5 5 5 Maximum Reverse Surge S Current IRSM{ Amps 143 132 124 112 103 96 90 82 Maximum Reverse Voltage g @ IRSM (Clamping Voltage) VRSM Volts 10.5 11.3 12.1 13.4 14.5 15.6 16.7 18.2 Maximum Temperature Coefficient of VBR %/C 0.057 0.061 0.065 0.068 0.073 0.075 0.078 0.081
Device Di Marking 6V8A 7V5A 8V2A 9V1A 10A 11A 12A 13A
1.5SMC15AT3 1.5SMC16AT3 1.5SMC18AT3 1.5SMC20AT3
1.5SMC22AT3 1.5SMC24AT3 1.5SMC27AT3 1.5SMC30AT3
14.3 15.2 17.1 19
20.9 22.8 25.7 28.5
15 16 18 20
22 24 27 30
15.8 16.8 18.9 21
23.1 25.2 28.4 31.5
1 1 1 1
1 1 1 1
12.8 13.6 15.3 17.1
18.8 20.5 23.1 25.6
5 5 5 5
5 5 5 5
71 67 59.5 54
49 45 40 36
21.2 22.5 25.2 27.7
30.6 33.2 37.5 41.4
0.084 0.086 0.088 0.09
0.092 0.094 0.096 0.097
15A 16A 18A 20A
22A 24A 27A 30A
1.5SMC33AT3 1.5SMC36AT3 1.5SMC39AT3 1.5SMC43AT3 1.5SMC47AT3 1.5SMC51AT3 1.5SMC56AT3 1.5SMC62AT3
1.5SMC68AT3 1.5SMC75AT3 1.5SMC82AT3 1.5SMC91AT3
31.4 34.2 37.1 40.9 44.7 48.5 53.2 58.9
64.6 71.3 77.9 86.5
33 36 39 43 47 51 56 62
68 75 82 91
34.7 37.8 41 45.2 49.4 53.6 58.8 65.1
71.4 78.8 86.1 95.5
1 1 1 1 1 1 1 1
1 1 1 1
28.2 30.8 33.3 36.8 40.2 43.6 47.8 53
58.1 64.1 70.1 77.8
5 5 5 5 5 5 5 5
5 5 5 5
33 30 28 25.3 23.2 21.4 19.5 17.7
16.3 14.6 13.3 12
45.7 49.9 53.9 59.3 64.8 70.1 77 85
92 103 113 125
0.098 0.099 0.1 0.101 0.101 0.102 0.103 0.104
0.104 0.105 0.105 0.106
33A 36A 39A 43A 47A 51A 56A 62A
68A 75A 82A 91A
* * VBR measured at pulse test current IT at an ambient temperaure of 25C. * * 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum.
{{ Surge current waveform per Figure 2 and derate per Figure 3 of General Data -- 1500 Watt at the beginning of this group. {{ T3 suffix designates tape and reel of 2500 units.
Devices listed in bold, italic are Motorola preferred devices.
1500 Watt Peak Power Data Sheet 5-80
Motorola TVS/Zener Device Data
1.5SMC6.8AT3 through 1.5SMC91AT3
Transient Voltage Suppressors -- Surface Mounted
1500 Watt Peak Power
0.171 4.343 S A 0.150 3.810 D B 0.110 2.794
inches mm
SMC Footprint
C K P J H
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. INCHES MILLIMETERS MIN MAX MIN MAX 6.60 7.11 0.260 0.280 5.59 6.10 0.220 0.240 1.90 2.41 0.075 0.095 2.92 3.07 0.115 0.121 0.0020 0.0060 0.051 0.152 0.15 0.30 0.006 0.012 0.76 1.27 0.030 0.050 0.020 REF 0.51 REF 7.75 8.13 0.305 0.320
CASE 403 (SMC)
(Refer to Section 10 for Surface Mount, Thermal Data and Footprint Information.)
DIM A B C D H J K P S
MULTIPLE PACKAGE QUANTITY (MPQ) REQUIREMENTS
Package Option Tape and Reel Type No. Suffix T3 (13 inch reel) MPQ (Units) 2.5K
(Refer to Section 10 for more information on Packaging Specifications.)
Devices listed in bold, italic are Motorola preferred devices.
Motorola TVS/Zener Device Data
1500 Watt Peak Power Data Sheet 5-81

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